About Corintis:

Corintis offers innovative microfluidic cooling technologies for AI chips/GPUs and CPUs used in data centers. Our solutions improve compute sustainability and tackle the excessive electricity consumption associated with data center cooling, which consumes more electricity than New York and London combined. With our software platform, Glacierware, our customers or us adapt microfluidic channels to the powermap of their chip, and we manufacture these into cold plate solutions or provide solutions to enable the customer to embed these cooling channels inside the package/the chip.

Working at Corintis:

Corintis offers a friendly and team-oriented workplace bringing together a diverse group of over 20 nationalities to solve the biggest computing challenges of tomorrow. Based on the EPFL campus near Lausanne, we are closely connected to the local ecosystem and are located a few minutes walk from Lake Geneva.

About the role:

We are seeking a Senior Thermal Mechanical Engineer with a focus on developing advanced liquid cooling solutions for high-performance computing (HPC) and AI chips. This role will involve designing, testing, and optimizing microfluidic cooling devices tailored to meet the demanding thermal requirements of modern computing hardware. The ideal candidate will have a strong technical background in thermal engineering, fluid dynamics, and heat transfer, coupled with industry experience in liquid cooling systems.

Responsibilties:

• Design and develop microfluidic cooling devices based on customer specifications.
• Utilize analytical and numerical modelling to support device design and performance optimization.
• Create mechanical components and assemblies for seamless integration between our product offerings and the customer requirements.
• Produce detailed technical drawings and oversee the manufacturing process maintaining high quality standards.
• Develop and implement specialized test setups to validate the cooling performance and packaging integrity of microfluidic solutions.
• Conduct experimental validation, including testing and data analysis, to characterize and refine prototype performance, ensuring optimal thermal and mechanical integration.
• Gather, analyse, and interpret data from experimental tests, using findings to inform and refine designs.
• Collaborate with customers to tailor solutions to specific HPC and AI platforms.
• Innovate advanced solutions for the mechanical integration of cooling devices into broader systems.
• Contribute to fundamental R&D activities within the Hardware team, fostering a collaborative environment.
• Research emerging technologies and trends in liquid cooling and thermal management. Drive the innovation of energy-efficient and environmentally sustainable cooling solutions.

Requirements:

• Education: M.Sc. in Mechanical Engineering, Microengineering, Materials Science, or a related field; a PhD is a plus.
• Experience: Minimum of 5 years relevant industrial experience in liquid cooling for electronic systems, ranging from R&D, product development, testing to industrialization. Ideally in data center applications.
• Technical Expertise:

• Strong proficiency in mechanical design, tolerancing, and technical drawing for manufacturing.
• Prior experience in leading a new product from design into volume production.
• Advanced CAD skills (Solidworks preferred).
• Extensive hands-on experience designing thermal management solutions for GPUs, CPUs, or custom AI accelerators.
• Good understanding of advanced packaging (2.5D, 3D integration) and the associated challenges related to thermal management.
• Knowledge of packaging and mechanical integration of microfluidic systems in commercial HPC or AI platforms.
• Familiarity with materials science as it relates to thermal management and system reliability for liquid cooling applications.
• Familiarity with failure mechanisms for liquid cooling in data center applications, and the associated qualifications and tests.
• Direct experience with various manufacturing techniques for both prototyping and final production. Familiarity with 3D manufacturing for rapid prototyping.
• Deep understanding of heat transfer and fluid dynamics, particularly at the microscale.
• Practical experience designing and building cooling loops and test benches for microchannel-based cooling systems.
• Knowledge of industry standards and best practices for liquid cooling in HPC and data centres such as ASHRAE and OCP.
• Coding skills in Python and Arduino are a plus.
• Skilled in creating clear, high-quality technical documentation.

• Soft Skills:

• Self-motivated and well-organized, with a high standard of work ethics.
• Excellent communication and interpersonal skills, able to collaborate with diverse teams.
• Strong problem-solving abilities and creative thinking, proactive in developing innovative solutions and proposing alternative ideas
• Fluent in English.

What we offer:

• A dynamic, flexible, innovative, and multicultural work environment, Employee stock participation plan (PSOP), and a high-quality office environment.
• Start date: ASAP
• Contract: Full time
• Activity rate: 100%
• Location: On-site , Corintis SA (Building C), EPFL innovation park, Switzerland

If you are excited about advancing liquid cooling technology for HPC and AI applications and meet the qualifications above, we’d love to hear from you!