About the opportunity:

We are looking for a motivated Thermal Mechanical Engineer to join our team working on the next-generation microfluidic cooling for high-performance computing applications. Due to our continued growth, we will likely hire multiple people for this position. The candidate will have a unique opportunity to work on leading-edge projects in partnership with key players in the semiconductor industry.

Corintis is a provider of advanced semiconductor cooling technologies. Some of the biggest challenges of our lifetime, from climate modeling to drug discovery, require ever increasing computing resources. As more specialized and powerful chips are being deployed in data centers all over the world, the efficient cooling of these large computing clusters has become a major economic and environmental concern. In fact, the electricity consumption devoted to data center cooling in the near future is estimated to match the combined consumption of London and New York. Moreover, next-generation chip designs are expected to be limited by current cooling technologies.

At Corintis, we address these challenges by integrating cooling directly inside the silicon chip. By doing so, we aim to enable the sustainable computing of the future and allow other innovators to work on the biggest global challenges. Today, we are working alongside some of the biggest names in the industry to enable the next generation of sustainable, high-performance data centers.

About the role:

● Develop microfluidic cooling devices based on the requirements of the customers.

● Use analytical and numerical models to support the design of the devices.

● Design mechanical components and assemblies for integration in our products.

● Produce detailed technical drawings and follow manufacturing of the parts with external suppliers.

● Design and develop dedicated test setups to validate the performance of microfluidic cooling devices and related packaging solutions.

● Perform the experimental validation and characterization of the prototypes.

● Develop advanced solutions for the mechanical integration of the proposed design.

● Contribute to the fundamental R&D activities of the Hardware team.

The ideal profile for us:

● M.Sc. in mechanical engineering, microengineering, material science, engineering. A previous relevant industrial/R&D experience would be a strong plus.

● Solid experience in mechanical design, tolerancing, and creation of technical drawings.

● Expert in the usage of CAD tools (ideally Solidworks).

● Previous direct experience with different manufacturing techniques for prototypes and/or final parts.

● Knowledge of heat transfer and fluid-dynamics, preferably at the microscale.

● Hands-on experience designing and building cooling loops and test beds for the characterization and validation of microchannel cooling systems.

● Previous experience with packaging and mechanical integration for microfluidics applications

● Experience with 3D manufacturing for prototyping

● Solid experience in Python and Arduino languages is a strong plus.

● Ability to “think out of the box” and generate creative solutions. Proactive in proposing alternative ideas.

● Demonstrated ability to write clear technical documentation of high quality

● Autonomous and proactive working style with excellent working organization and ethics.

● Communicating effectively, excellent relational skills, and able to work in a team with different professional and cultural backgrounds.

● Demonstrated skills in problem solving and creative thinking.

● Fluent in English.

● Get things done mentality

What we offer:

● A dynamic, flexible, innovative, and multicultural work environment

bridging the gap between cutting-edge academia and a deep tech startup.

● Start date: ASAP

● Activity rate: 100%

● Location: Corintis SA, EPFL Innovation park office, Lausanne, Switzerland